Invention Grant
- Patent Title: Gate-all-around fin device
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Application No.: US16585651Application Date: 2019-09-27
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Publication No.: US10593805B2Publication Date: 2020-03-17
- Inventor: John B. Campi, Jr. , Robert J. Gauthier, Jr. , Rahul Mishra , Souvick Mitra , Mujahid Muhammad
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/08 ; H01L29/423 ; H01L27/088 ; H01L21/8234 ; H01L21/266 ; H01L21/265 ; H01G4/33 ; H01G4/30 ; H01G4/228 ; H01G4/14 ; H01G4/005 ; B32B27/36 ; B32B27/34 ; B32B27/32 ; B32B27/30 ; B32B27/28 ; B32B27/08 ; B32B27/00 ; B32B7/02 ; B32B3/08 ; B29C37/00 ; H01L29/66 ; H01L29/06 ; B29C48/49 ; B29C48/21 ; H01G4/20 ; B29L31/34 ; B29L9/00 ; B29K507/04 ; B29K105/16 ; B29K23/00

Abstract:
A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.
Public/Granted literature
- US20200027987A1 GATE-ALL-AROUND FIN DEVICE Public/Granted day:2020-01-23
Information query
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