Invention Grant
- Patent Title: Array substrate and fabricating method thereof
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Application No.: US16002077Application Date: 2018-06-07
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Publication No.: US10593807B2Publication Date: 2020-03-17
- Inventor: Wei Wu
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Hemisphere Law, PLLC
- Agent Zhigang Ma
- Priority: CN201711439798 20171226
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/786 ; H01L29/423 ; H01L29/417 ; H01L21/4757 ; H01L21/441

Abstract:
An array substrate is disclosed, including a thin film transistor including a substrate, a first gate, a first insulating layer, an active layer, a source, a drain, a second and a third insulating layers, and a second gate. The first gate is disposed on the substrate, the first insulating layer is disposed on the first gate and the substrate, and the active layer is disposed on the first insulating layer, the source and the drain disposed on the active layer form a channel with the active layer, the second insulating layer, the third insulating layer, and the second gate are sequentially disposed in the channel region, a distance between an edge of the second insulating layer and the source and the drain is greater than a distance between an edge of the third insulating layer and the source and the drain.
Public/Granted literature
- US20190198677A1 ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF Public/Granted day:2019-06-27
Information query
IPC分类: