Invention Grant
- Patent Title: Metal powder sintering paste, method for producing the same, and method for producing conductive material
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Application No.: US15964568Application Date: 2018-04-27
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Publication No.: US10593851B2Publication Date: 2020-03-17
- Inventor: Teppei Kunimune , Masafumi Kuramoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2017-090197 20170428
- Main IPC: H01B1/16
- IPC: H01B1/16 ; H01L33/62 ; H01B1/22 ; B23K35/30 ; B22F1/00 ; B23K35/02 ; B22F3/10 ; H01L23/00 ; B23K35/36
Abstract:
Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 μm to 5 μm as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.
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