Invention Grant
- Patent Title: Atomic layer deposition of ultrathin tunnel barriers
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Application No.: US15985979Application Date: 2018-05-22
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Publication No.: US10593871B2Publication Date: 2020-03-17
- Inventor: Judy Z. Wu , Jamie Wilt , Ryan Goul , Jagaran Acharya
- Applicant: University of Kansas
- Applicant Address: US KS Lawrence
- Assignee: UNIVERSITY OF KANSAS
- Current Assignee: UNIVERSITY OF KANSAS
- Current Assignee Address: US KS Lawrence
- Agency: Bell & Manning, LLC
- Main IPC: H01L43/12
- IPC: H01L43/12 ; H01L43/08 ; H01L39/22 ; H01L39/24

Abstract:
Methods for forming tunnel barrier layers are provided, including a method comprising exposing a surface of a material, the surface free of oxygen, to an initial water pulse for a pulse time and at a pulse temperature, the pulse time and pulse temperature selected to maximize hydroxylation of the surface; and exposing the hydroxylated surface to alternating, separated pulses of precursors under conditions to induce reactions between the hydroxylated surface and the precursors to form a tunnel barrier layer on the surface of the material via atomic layer deposition (ALD), the tunnel barrier layer having an average thickness of no more than 1 nm and being formed without an intervening interfacial layer between the tunnel barrier layer and the surface of the material.
Public/Granted literature
- US20190013463A1 ATOMIC LAYER DEPOSITION OF ULTRATHIN TUNNEL BARRIERS Public/Granted day:2019-01-10
Information query
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