Invention Grant
- Patent Title: Wireless communications package with integrated antenna array
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Application No.: US15368600Application Date: 2016-12-03
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Publication No.: US10594019B2Publication Date: 2020-03-17
- Inventor: Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
- Applicant: International Business Machines Corporation , Ericsson AB
- Applicant Address: US NY Armonk SE Stockholm
- Assignee: International Business Machines Corporation,Ericsson AB
- Current Assignee: International Business Machines Corporation,Ericsson AB
- Current Assignee Address: US NY Armonk SE Stockholm
- Agency: Ryan, Mason & Lewis, LLP
- Agent Daniel Morris
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q9/04 ; H01Q21/06 ; H01Q1/38 ; H01Q1/48 ; H01Q1/52 ; H01Q21/24

Abstract:
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
Public/Granted literature
- US20180159203A1 WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY Public/Granted day:2018-06-07
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