Invention Grant
- Patent Title: Shielded high density jack
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Application No.: US16196923Application Date: 2018-11-20
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Publication No.: US10594088B2Publication Date: 2020-03-17
- Inventor: Kenneth Alan Cupples , Dylan Robert Petruskevicius
- Applicant: Ortronics, Inc.
- Applicant Address: US CT New London
- Assignee: Ortronics, Inc.
- Current Assignee: Ortronics, Inc.
- Current Assignee Address: US CT New London
- Agency: McCarter & English, LLP
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6593 ; H01R13/6596 ; H01R13/6582 ; H01R13/502 ; H01R13/66 ; H01R4/2425 ; H01R13/506 ; H01R13/46 ; H01R24/64 ; H01R12/71 ; H01R13/518

Abstract:
Advantageous electrical connector assemblies or jack assemblies/housings for use in communication systems are provided. The present disclosure provides systems/methods for the design and use of high density shielded modular electrical connectors that include improved shielding techniques. The present disclosure provides for a direct shielded connection throughout a shielded modular electrical connector. The shielded modular electrical connector provides for a single continuous contact with a shielded cable. The electrical connector assemblies are configured to facilitate a direct shielding connection that minimizes the connection path and provides a more direct connection to plug/cable and/or foil/cable ground wire and mounting panel. The shielding assembly includes a modular voice/data/video connector that further includes a modular plug contact and a wrap-around shield contact. The modular plug contact can include both cable shield contacts and plug contacts. The wrap-around shield contact can include a continuously formed material that captures a cable shield.
Public/Granted literature
- US20190157813A1 Shielded High Density Jack Public/Granted day:2019-05-23
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