Invention Grant
- Patent Title: Combining power amplifiers at millimeter wave frequencies
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Application No.: US16370087Application Date: 2019-03-29
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Publication No.: US10594279B2Publication Date: 2020-03-17
- Inventor: Krishnanshu Dandu , Brian Paul Ginsburg
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michelle F. Murray; Charles A. Brill; Frank D. Cimino
- Main IPC: H03F3/68
- IPC: H03F3/68 ; H03F3/24 ; H03G3/30 ; G01S7/03 ; G01S13/931 ; H01Q1/32 ; H01Q21/08 ; H03F3/195 ; H03F3/21 ; H03F3/45 ; H01Q9/06 ; H03H7/48 ; H04B1/04

Abstract:
A system having a set of power amplifiers each having a primary inductive structure configured to provide an output signal. A secondary inductive structure is configured to inductively couple to each of the primary inductive structures. A transmission line is provided with a signal trace and a ground trace. The signal trace of the transmission line is connected to a first end of the secondary inductive structure. A return path from a second end of the secondary inductive structure is coupled via a resonant network to the ground trace of the transmission line, in which the return path is spaced away from the secondary inductive structure to minimize inductive coupling to the primary structures.
Public/Granted literature
- US20190229425A1 Combining Power Amplifiers at Millimeter Wave Frequencies Public/Granted day:2019-07-25
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