Invention Grant
- Patent Title: Multilayer resonant circuit component, packaged multilayer resonant circuit component, and multilayer resonant circuit component manufacturing method
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Application No.: US16122812Application Date: 2018-09-05
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Publication No.: US10594288B2Publication Date: 2020-03-17
- Inventor: Rikiya Sano , Shimpei Tanabe
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2017-172852 20170908
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01F17/00 ; H05K1/16 ; H01G4/005 ; H01G4/40 ; H01G4/012 ; H03H1/00 ; H01G4/30

Abstract:
A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.
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