Invention Grant
- Patent Title: Method of reducing warpage of an organic substrate
-
Application No.: US15872009Application Date: 2018-01-16
-
Publication No.: US10595399B2Publication Date: 2020-03-17
- Inventor: Sayuri Hada , Hiroyuki Mori , Keishi Okamoto
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K1/02 ; G01B21/08 ; G01B21/20 ; H05K3/00 ; H05K3/22 ; H05K1/03 ; H05K3/46

Abstract:
An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.
Public/Granted literature
- US20190053370A1 METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE Public/Granted day:2019-02-14
Information query