Invention Grant
- Patent Title: Integrated wiring system for composite structures
-
Application No.: US16113909Application Date: 2018-08-27
-
Publication No.: US10595428B2Publication Date: 2020-03-17
- Inventor: Hardik Dalal , Jeffrey Lynn Duce , Yelina Rosillo , Brent A. Robbins , Breana K. Merriweather
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: C23C4/134
- IPC: C23C4/134 ; H05K3/14 ; H05K3/38 ; H05K3/46 ; H05K7/06 ; C23C4/08 ; H05K1/02 ; B64D45/00 ; C23C4/01 ; B64F5/00

Abstract:
A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. An embodiment may include the group of conductive elements within a layer of material co-bonded to the composite part. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements.
Public/Granted literature
- US20190008065A1 INTEGRATED WIRING SYSTEM FOR COMPOSITE STRUCTURES Public/Granted day:2019-01-03
Information query
IPC分类: