A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.