Invention Grant
- Patent Title: Electronic stickers with modular structures
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Application No.: US15980564Application Date: 2018-05-15
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Publication No.: US10595781B2Publication Date: 2020-03-24
- Inventor: Junfeng Mei , Jiang Li
- Applicant: VivaLnk, Inc.
- Applicant Address: US CA Campbell
- Assignee: VivaLnk, Inc.
- Current Assignee: VivaLnk, Inc.
- Current Assignee Address: US CA Campbell
- Agency: SV Patent Service
- Main IPC: A61B5/00
- IPC: A61B5/00 ; H04B5/00 ; A61B5/04 ; A61B5/01

Abstract:
An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.
Public/Granted literature
- US20180256107A1 Electronic Stickers with Modular Structures Public/Granted day:2018-09-13
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