Invention Grant
- Patent Title: Three-dimensional deposition device and three-dimensional deposition method
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Application No.: US15300186Application Date: 2015-03-19
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Publication No.: US10596630B2Publication Date: 2020-03-24
- Inventor: Hitoshi Yoshimura , Yoshiharu Ozawa
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2014-074056 20140331
- International Application: PCT/JP2015/058292 WO 20150319
- International Announcement: WO2015/151839 WO 20151008
- Main IPC: B22F3/24
- IPC: B22F3/24 ; B33Y30/00 ; B22F3/105 ; B23K26/342 ; B29C64/20 ; B29C64/153 ; B29C64/386 ; B33Y10/00 ; B33Y40/00 ; B33Y50/02

Abstract:
Provided is a three-dimensional deposition device which forms a three-dimensional object by depositing a formed layer on a base unit, comprising: a powder supply unit which supplies a powder material; a light irradiation unit which irradiates the powder material with a light beam and forms a formed layer by sintering or melting and solidifying at least a part of the powder material irradiated with the light beam; a machining unit which includes a tool and performs a machining operation on the formed layer by the tool; and a controller which serves as a control device controlling an operation of at least one of the powder supply unit, the light irradiation unit, and the machining unit.
Public/Granted literature
- US20170136545A1 THREE-DIMENSIONAL DEPOSITION DEVICE AND THREE-DIMENSIONAL DEPOSITION METHOD Public/Granted day:2017-05-18
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