Invention Grant
- Patent Title: Workpiece holder and method for slicing workpiece
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Application No.: US15746941Application Date: 2016-07-12
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Publication No.: US10596724B2Publication Date: 2020-03-24
- Inventor: Shiroyasu Watanabe
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-148107 20150727
- International Application: PCT/JP2016/003287 WO 20160712
- International Announcement: WO2017/017919 WO 20170202
- Main IPC: B28D5/00
- IPC: B28D5/00 ; B28D5/04

Abstract:
A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.
Public/Granted literature
- US20180215075A1 WORKPIECE HOLDER AND METHOD FOR SLICING WORKPIECE Public/Granted day:2018-08-02
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