Invention Grant
- Patent Title: Liquid ejection head substrate and liquid ejection head
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Application No.: US16009440Application Date: 2018-06-15
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Publication No.: US10596816B2Publication Date: 2020-03-24
- Inventor: Ryo Kasai
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JP2017-127791 20170629
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/045

Abstract:
A liquid ejection head substrate has heating unit and an element array in which a plurality of ejection energy generating elements generating ejection energy for liquid ejection are arranged on a surface side of a base material. The heating unit includes a heating element extending in a direction of the element array and generating heat by being energized, wiring spaced apart from the heating element in a direction orthogonal to the surface of the base material, and a plurality of connecting portions connecting the heating element and the wiring to each other. The heating element, the wiring, and the plurality of connecting portions are provided in a region overlapping a region where the element array is disposed in a direction orthogonal to the direction of the element array when seen from the direction orthogonal to the surface of the base material. A current flows to the wiring in a middle of a path of the current flowing through the heating element when the heating element is energized.
Public/Granted literature
- US20190001677A1 LIQUID EJECTION HEAD SUBSTRATE AND LIQUID EJECTION HEAD Public/Granted day:2019-01-03
Information query
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