- Patent Title: Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element
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Application No.: US14779738Application Date: 2014-03-24
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Publication No.: US10597766B2Publication Date: 2020-03-24
- Inventor: Katsunari Obata , Toshihiko Takeda , Hiroshi Kawasaki , Hiroyuki Nishimura , Atsushi Maki , Hiromitsu Ochiai , Yoshinori Hirobe
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2013-063295 20130326; JP2014-059432 20140324
- International Application: PCT/JP2014/058045 WO 20140324
- International Announcement: WO2014/157068 WO 20141002
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L21/00 ; C23C14/04 ; H01L51/56

Abstract:
There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition.A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.
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