Invention Grant
- Patent Title: Vapor deposition source, vapor deposition apparatus and method for producing vapor-deposited film
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Application No.: US15741296Application Date: 2016-07-21
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Publication No.: US10597770B2Publication Date: 2020-03-24
- Inventor: Shinichi Kawato , Katsuhiro Kikuchi , Manabu Niboshi , Satoshi Inoue , Yuhki Kobayashi
- Applicant: Sharp Kabushiki Kaisha
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: Keating & Bennett, LLP
- Priority: JP2015-148966 20150728
- International Application: PCT/JP2016/071397 WO 20160721
- International Announcement: WO2017/018314 WO 20170202
- Main IPC: C23C14/24
- IPC: C23C14/24 ; H01L51/00
Abstract:
Provided is a line source that can achieve uniform film thickness distribution and also achieve high use efficiency of vapor deposition materials. A line source (10) has slit nozzles (1) having a slit nozzle's length-to-width ratio of 4 to 50, a width of 1 mm to 5 mm, and a depth of 5 mm to 20 mm.
Public/Granted literature
- US20180187299A1 VAPOR DEPOSITION SOURCE, VAPOR DEPOSITION APPARATUS AND METHOD FOR PRODUCING VAPOR-DEPOSITED FILM Public/Granted day:2018-07-05
Information query
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