An electrically conductive material for a connection component that includes a Cu—Sn alloy coating layer in which a Cu content is 55 to 70 atomic % and has an average thickness of 0.1 to 3.0 μm, and a Sn coating layer having an average thickness of 0.2 to 5.0 μm, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%. Further, when the region A is observed with the scanning electron microscope at a magnification of 10,000 times, a region C covered with the Sn coating layer and a region D not covered with the Sn coating layer coexist in the region A, and the area ratio of the region C in the region A is 20 to 70%.