- Patent Title: Method for manufacturing dye-attached substrate and printing device
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Application No.: US15852754Application Date: 2017-12-22
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Publication No.: US10597818B2Publication Date: 2020-03-24
- Inventor: Minoru Inuzuka , Hirokazu Hyodo , Koji Abe
- Applicant: NIDEK CO., LTD.
- Applicant Address: JP Gamagori-shi
- Assignee: NIDEK CO., LTD.
- Current Assignee: NIDEK CO., LTD.
- Current Assignee Address: JP Gamagori-shi
- Agency: Oliff PLC
- Priority: JP2015-128904 20150626; JP2015-128905 20150626; JP2015-128906 20150626; JP2015-128907 20150626
- Main IPC: D06P5/28
- IPC: D06P5/28 ; B41M5/035 ; B41M5/00 ; D06P5/00 ; B29D11/00

Abstract:
A method for manufacturing a dye-attached substrate provided with a dye section that includes a sublimable dye to be deposited on a resin body includes a printing step of printing a plurality of units of the dye sections, the dye section for dyeing one resin body or one set of resin bodies constituting one unit, lined up in a longitudinal direction of a long thin substrate, by discharging ink that includes the sublimable dye on the substrate using a printing device, a piece creating step of creating a piece of the substrate that includes the plurality of units of the dye sections, by cutting the substrate on which the dye section is printed, and a drying step of drying the ink of the plurality of units of the dye sections included in the piece of the substrate.
Public/Granted literature
- US20180119340A1 METHOD FOR MANUFACTURING DYE-ATTACHED SUBSTRATE AND PRINTING DEVICE Public/Granted day:2018-05-03
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