Invention Grant
- Patent Title: Panel assemblies and methods to assemble the same
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Application No.: US16390414Application Date: 2019-04-22
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Publication No.: US10597866B2Publication Date: 2020-03-24
- Inventor: David Chadwell
- Applicant: Harper Engineering Co.
- Applicant Address: US WA Renton
- Assignee: HARPER ENGINEERING CO.
- Current Assignee: HARPER ENGINEERING CO.
- Current Assignee Address: US WA Renton
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: F16B5/01
- IPC: F16B5/01 ; E04B1/41 ; E04C2/36 ; F16B5/02 ; F16B37/00 ; B64C1/06

Abstract:
A panel assembly can include a first panel having a peripheral side located between an upper and a lower surface of the first panel and a first opening. The panel assembly can also include a second panel having a second opening. An elongated insert can be coupled to the first panel, the elongated insert having a coupling side, where the first opening of the first panel can be sized and shaped to coupleably receive the elongated insert such that the coupling side is positioned proximal to the peripheral side. The panel assembly can also include a fastening insert, where the second opening of the second panel can be sized and shaped to receive the fastening insert. A fastener can be received by the fastening insert and the elongated insert, the fastener coupling the first panel to the second panel via the fastening insert and the elongated insert. Related methods for assembling the panel assembly are also provided.
Public/Granted literature
- US20190249416A1 PANEL ASSEMBLIES AND METHODS TO ASSEMBLE THE SAME Public/Granted day:2019-08-15
Information query