Invention Grant
- Patent Title: Cooling device for additive injection valve and cooling system
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Application No.: US16227223Application Date: 2018-12-20
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Publication No.: US10598075B2Publication Date: 2020-03-24
- Inventor: Junya Iida
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2017-248242 20171225
- Main IPC: F01P3/12
- IPC: F01P3/12 ; F01N3/04 ; F01N3/20
Abstract:
A cooling device for an additive injection valve is connected to a circulation circuit for coolant in parallel with a different cooling device. The cooling device includes a coolant path through which the coolant flows, and a movable member that receives a flow of the coolant and shifts to vary a passage area of a predetermined portion of the coolant path.
Public/Granted literature
- US20190195118A1 COOLING DEVICE FOR ADDITIVE INJECTION VALVE AND COOLING SYSTEM Public/Granted day:2019-06-27
Information query
