Invention Grant
- Patent Title: Test socket for a chip
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Application No.: US15599382Application Date: 2017-05-18
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Publication No.: US10598693B2Publication Date: 2020-03-24
- Inventor: Yu-Hsin Chen , Ho-Chu Kao
- Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Current Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Foley & Lardner LLP
- Priority: CN201710237925 20170412
- Main IPC: G01R1/04
- IPC: G01R1/04

Abstract:
The present disclosure relates to a test socket for a chip, which comprises: a recess for receiving the chip and two push mechanisms. The recess is surrounded by four sections. The two push mechanisms are respectively arranged at two adjacent sections. Each of the two push mechanisms comprises: a push button, wherein a bottom of the push button is connected to a vertical elastic member; a pusher cooperated with the push button, wherein one end of the pusher extends into the recess and the opposite end of the pusher is connected to a lateral elastic member. When the push button is upwardly pushed by the vertical elastic member, a top of the push button protrudes from a top surface of the section and the pusher will be engaged with the push button. When the push button is pressed and moves downwardly, the lateral elastic member pushes the pusher to move toward the recess.
Public/Granted literature
- US20180299483A1 TEST SOCKET FOR A CHIP Public/Granted day:2018-10-18
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