A stacked body includes a base including insulating base material layers made of thermoplastic resin and stacked, a circuit including a conductive pattern located on the insulating base material layers, and a dummy pattern electrically isolated from the circuit and extending along a portion of the circuit outside of the circuit on the insulating base material layers on which the conductive pattern is located in a plan view. The conductive pattern includes a linear portions at an outermost side of the circuit in a plan view. A bent portion or a wide portion, which has a larger width than the other linear portions in a direction perpendicular or substantially perpendicular to a direction in which a linear portion extends, in a plan view, is located on at least one of the linear portion of the conductive pattern and the dummy pattern extending along the linear portion.