Invention Grant
- Patent Title: Inductor having via connection layer
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Application No.: US15457475Application Date: 2017-03-13
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Publication No.: US10600553B2Publication Date: 2020-03-24
- Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0095686 20160727
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/29 ; H01F27/24 ; H01F17/04

Abstract:
An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and a via connection layer disposed between the first coil layer and the second coil layer and electrically connected to the first and second vias.
Public/Granted literature
- US20180033539A1 INDUCTOR HAVING VIA CONNECTION LAYER Public/Granted day:2018-02-01
Information query