Invention Grant
- Patent Title: Method for manufacturing epitaxial silicon wafer and vapor phase growth device
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Application No.: US15531579Application Date: 2015-12-07
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Publication No.: US10600651B2Publication Date: 2020-03-24
- Inventor: Masayuki Tsuji , Akihiko Shimizu , Tomokazu Nishimura
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-248075 20141208
- International Application: PCT/JP2015/084290 WO 20151207
- International Announcement: WO2016/093195 WO 20160616
- Main IPC: C30B25/02
- IPC: C30B25/02 ; H01L21/20 ; H01L21/02 ; H01L21/67 ; C30B35/00 ; C23C16/44 ; C23C16/46 ; C30B29/06 ; H01L21/322

Abstract:
A vapor deposition apparatus includes an exhaust regulator provided in an exhaust pipe to regulate exhaust of the reaction chamber and including: a hollow frustum upstream baffle having a larger first opening near a reaction chamber than a second opening near an exhaust device; and a hollow frustum downstream baffle provided near the exhaust device with respect to the upstream baffle and having a larger third opening near the reaction chamber than a fourth opening near the exhaust device. The upstream baffle and downstream baffle are designed so that B/A and C/A are 0.33 or less, at least one of B/A and C/A is 0.26 or less, and (B+C)/A is 0.59 or less, where an inner diameter of the exhaust pipe and diameters of the first and third openings are A, a diameter of the second opening is B and a diameter of the fourth opening is C.
Public/Granted literature
- US20170338117A1 METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER AND VAPOR PHASE GROWTH DEVICE Public/Granted day:2017-11-23
Information query
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