Invention Grant
- Patent Title: Electronic device
-
Application No.: US15570864Application Date: 2017-02-20
-
Publication No.: US10600712B2Publication Date: 2020-03-24
- Inventor: Yuji Morinaga , Soichiro Umeda
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/006023 WO 20170220
- International Announcement: WO2018/150553 WO 20180823
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/07 ; H01L23/482 ; H01L23/48 ; H01L23/00 ; H01L25/18

Abstract:
An electronic device has a substrate 5, a first electric element 91 provided on a first conductor layer 71, a second electric element 92 provided on the first electric element 91, and a connector 50 having a base end part 45 provided on a second conductor layer 72 and a head part 40 provided on a front surface electrode 92a of the second electric element 92 via a conductive adhesive 75. An area of the base end part 45 placed on the second conductor layer 72 is larger than an area of the head part 40 placed on the second electric element 92. The base end part 45 is located at a side of the substrate 5 compared with the head part 40, and a gravity center position of the connector 50 is at a side of the base end part 45 of the connector 50.
Public/Granted literature
- US20190051577A1 ELECTRONIC DEVICE Public/Granted day:2019-02-14
Information query
IPC分类: