Invention Grant
- Patent Title: Integrated circuit chip packaging
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Application No.: US15589131Application Date: 2017-05-08
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Publication No.: US10600715B2Publication Date: 2020-03-24
- Inventor: Young Hoon Kwark
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Daniel P. Morris
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/13 ; H01L23/66 ; H05K1/18 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L25/16
Abstract:
A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.
Public/Granted literature
- US20170243816A1 INTEGRATED CIRCUIT CHIP PACKAGING Public/Granted day:2017-08-24
Information query
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