- Patent Title: Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
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Application No.: US15504807Application Date: 2015-08-24
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Publication No.: US10600719B2Publication Date: 2020-03-24
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2014-171900 20140826; JP2015-161292 20150818
- International Application: PCT/JP2015/073680 WO 20150824
- International Announcement: WO2016/031754 WO 20160303
- Main IPC: B23K1/19
- IPC: B23K1/19 ; B23K20/16 ; B23K20/22 ; B23K35/24 ; B23K35/36 ; H01L23/373 ; H01L23/14 ; H01L21/48 ; H01L23/498 ; H01L23/473
Abstract:
The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be less than a eutectic temperature of a metal element that constitutes the metal member and aluminum. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.
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