- Patent Title: Interposer with interconnects and methods of manufacturing the same
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Application No.: US16059943Application Date: 2018-08-09
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Publication No.: US10600739B1Publication Date: 2020-03-24
- Inventor: Florian G. Herrault , Zak C. Eckel , Tobias A. Schaedler , Robert Mone
- Applicant: HRL LABORATORIES, LLC
- Applicant Address: US CA Malibu
- Assignee: HRL Laboratories, LLC
- Current Assignee: HRL Laboratories, LLC
- Current Assignee Address: US CA Malibu
- Agency: Lewis Roca Rothgerber Christie, LLC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/15 ; H01L23/50 ; H01L23/498 ; H01L23/00 ; B29C64/10 ; H05K1/03
Abstract:
An interposer includes an interposer substrate having a series of vias, and a series of metallic interconnects in the series of vias. The interposer substrate has a first surface and a second surface opposite the first surface. The interposer substrate includes a dielectric material. A first pitch of the series of vias at a first end of the series of vias is different than a second pitch of the series of vias at a second end of the series of vias.
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