Invention Grant
- Patent Title: Ultra-thin thermally enhanced electro-magnetic interference shield package
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Application No.: US16129124Application Date: 2018-09-12
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Publication No.: US10600743B2Publication Date: 2020-03-24
- Inventor: Ching-Fong Lee , Heap-Hooi Nyeo , Chin-Chooi Ch'ng , Ooi-Lin Cheng
- Applicant: Inari Semiconductor Labs Sdn Bhd
- Applicant Address: MY Bayan Lepas
- Assignee: Inari Semiconductor Labs Sdn Bhd
- Current Assignee: Inari Semiconductor Labs Sdn Bhd
- Current Assignee Address: MY Bayan Lepas
- Agency: Smirman IP Law, PLLC
- Agent Preston Smirman
- Priority: MY2017704259 20171108
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/373 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/42 ; H01L21/683
Abstract:
A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.
Public/Granted literature
- US20190139902A1 ULTRA-THIN THERMALLY ENHANCED ELECTRO-MAGNETIC INTERFERENCE SHIELD PACKAGE Public/Granted day:2019-05-09
Information query
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