Invention Grant
- Patent Title: Resin-encapsulated semiconductor device and method of manufacturing the same
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Application No.: US16507308Application Date: 2019-07-10
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Publication No.: US10600752B2Publication Date: 2020-03-24
- Inventor: Noriyuki Kimura
- Applicant: ABLIC Inc.
- Applicant Address: JP
- Assignee: ABLIC Inc.
- Current Assignee: ABLIC Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2017-065909 20170329
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L29/417 ; H01L21/288 ; H01L21/78 ; H01L21/3105 ; H01L23/31 ; H01L21/683
Abstract:
A resin-encapsulated semiconductor device includes a bump electrode formed on an element surface side of a semiconductor chip, a conductive layer electrically connected to the bump electrode, and a resin encapsulation body covering the semiconductor chip, the bump electrode, and the conductive layer. On a back surface of the semiconductor chip that is flush with a back surface of the resin encapsulation body, a metal layer and a laminated film are formed. The laminated film is formed on a front surface of the conductive layer, and an external terminal is arranged on an inner side of an outer edge of the semiconductor chip.
Public/Granted literature
- US20190333888A1 RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-10-31
Information query
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