There is provided a bonding method capable of accurately positioning a bonding stage. According to an aspect of the present invention, a bonding method using a bonding apparatus including a rotation drive mechanism for rotating a bonding stage 1 about a θ-axis includes the steps of: (e) locking the bonding stage with respect to the θ-axis, and bonding a wire or bump onto a certain area of a substrate held on the bonding stage; (f) unlocking the bonding stage with respect to the θ-axis, and rotating the bonding stage about the θ-axis with the rotation drive mechanism; and (g) locking the bonding stage with respect to the θ-axis, and bonding a wire or bump onto a remaining region of the substrate.