Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16298173Application Date: 2019-03-11
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Publication No.: US10600757B2Publication Date: 2020-03-24
- Inventor: Iou Ming Lou
- Applicant: Chengwei Wu
- Applicant Address: TW New Taipei
- Assignee: Chengwei Wu
- Current Assignee: Chengwei Wu
- Current Assignee Address: TW New Taipei
- Agency: WPAT, PC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L23/522 ; H01L25/18 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L25/10 ; H01L25/11 ; H01L25/00 ; H01L21/56 ; H01L23/13
Abstract:
A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.
Public/Granted literature
- US20190206838A1 Semiconductor Package Public/Granted day:2019-07-04
Information query
IPC分类:
