Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16255949Application Date: 2019-01-24
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Publication No.: US10600777B1Publication Date: 2020-03-24
- Inventor: Hisao Ichijo , Syotaro Ono , Hiroaki Yamashita
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Minato-ku JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Minato-ku JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2018-168849 20180910
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/528 ; H01L23/00 ; H01L23/49 ; H01L29/78 ; H01L29/739

Abstract:
A semiconductor device includes a semiconductor body, first to third electrodes provided on the semiconductor body, and a control electrode. The control electrode is provided between the semiconductor body and the first electrode. The semiconductor body includes first to sixth layers. The second layer of a second conductivity type is selectively provided between the first layer of a first conductivity type and the first electrode. The third layer of the first conductivity type is selectively provided between the second layer and the first electrode. The fourth layer of the second conductivity type is provided between the first layer and the second and third electrodes. The fifth layer of the first conductivity type is selectively provided in the fourth layer and electrically connected to the first electrode. The sixth layer of the first conductivity type is provided in the fourth layer, and electrically connected to the third electrode.
Public/Granted literature
- US20200083215A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-03-12
Information query
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