Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16237764Application Date: 2019-01-02
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Publication No.: US10600782B2Publication Date: 2020-03-24
- Inventor: Takaya Nagai
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2018-002852 20180111
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/861 ; H01L29/40 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/739

Abstract:
A semiconductor device may include a semiconductor substrate. A semiconductor substrate may include a diode region and an IGBT region provided adjacent to the diode region. The IGBT region may include a plurality of first conductive-type low concentration regions provided between a buffer region and a collector region, arranged with intervals therebetween in a direction parallel to the semiconductor substrate, and having a lower impurity concentration than the collector region. The collector region may include a first contact portion that is in contact with the buffer region between the low concentration regions adjacent to each other.
Public/Granted literature
- US20190214383A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-07-11
Information query
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