Invention Grant
- Patent Title: Manufacturing method of array substrate
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Application No.: US16247592Application Date: 2019-01-15
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Publication No.: US10600812B2Publication Date: 2020-03-24
- Inventor: Wen-Yi Hsu , Pei-Ming Chen , Maw-Song Chen
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107121013A 20180619
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32 ; G02F1/1343 ; G02F1/1345

Abstract:
A manufacturing method of an array substrate including following steps is provided. A plurality of scan lines are formed on a substrate having a pixel region and a fan-out region. A plurality of data lines are formed. A plurality of transistors are formed and respectively electrically connected to the corresponding scan lines and data lines. A plurality of common electrodes are formed. A plurality of pixel electrodes are formed and respectively electrically connected to the corresponding transistors. A plurality of first fan-out lines, second fan-out lines, and third fan-out lines are formed in the fan-out region. Each of the third fan-out lines includes a transparent conductive layer and an auxiliary conductive layer located on and contacting the transparent conductive layer. The third fan-out lines and the common electrodes are formed by the same photomask.
Public/Granted literature
- US20190386032A1 MANUFACTURING METHOD OF ARRAY SUBSTRATE Public/Granted day:2019-12-19
Information query
IPC分类: