- Patent Title: High voltage termination structure of a power semiconductor device
-
Application No.: US15791943Application Date: 2017-10-24
-
Publication No.: US10600862B2Publication Date: 2020-03-24
- Inventor: Erich Griebl , Frank Wolter , Andreas Moser , Manfred Pfaffenlehner
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016120300 20161025
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/40 ; H01L21/761 ; H01L21/765 ; H01L29/739 ; H01L29/417 ; H01L29/861

Abstract:
A power semiconductor device includes a semiconductor body coupled to first and second load terminals and including a drift region with dopants of a first conductivity type. An active region has at least one power cell extending at least partially into the semiconductor body, is electrically connected with the first load terminal and includes a part of the drift region. Each power cell includes a section of the drift region and is configured to conduct a load current between the terminals and to block a blocking voltage applied between the terminals. A chip edge laterally terminates the semiconductor body. A non-active termination structure arranged in between the chip edge and active region includes an ohmic layer. The ohmic layer is arranged above a surface of the semiconductor body, forms an ohmic connection between electrical potentials of the first and second load terminals, and is laterally structured along the ohmic connection.
Public/Granted literature
- US20180114830A1 High Voltage Termination Structure of a Power Semiconductor Device Public/Granted day:2018-04-26
Information query
IPC分类: