Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16027978Application Date: 2018-07-05
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Publication No.: US10600880B2Publication Date: 2020-03-24
- Inventor: Tsutomu Kiyosawa , Yasuyuki Yanase , Kazuhiro Kagawa
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-182330 20140908
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L23/544 ; H01L21/02 ; H01L21/324 ; H01L21/04 ; H01L29/04 ; H01L29/10 ; H01L29/16 ; H01L29/66 ; H01L21/205

Abstract:
A semiconductor device includes a substrate having a main surface inclined in an off-direction from a {0001} surface, and a semiconductor layer. The semiconductor layer includes a level difference for alignment mark. An epitaxial layer is disposed on a first portion of the main surface, the first portion being situated on an off-angle upstream side of the level difference, and on a second portion of the main surface, the second portion being situated on an off-angle downstream side of the level difference. A value of |WL−WR| is 1 μm or less, in which WL represents a distance from a center of the level difference to a boundary between an off-angle upstream side corner portion of the level difference and a main surface or a {0001} facet plane generated on the main surface, and WR represents a distance from the center of the level difference to a boundary between an off-angle downstream side corner portion of the level difference and the main surface or the {0001} facet plane generated on the main surface.
Public/Granted literature
- US20180315823A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-11-01
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