Invention Grant
- Patent Title: Contact to metal gate isolation structure
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Application No.: US15925364Application Date: 2018-03-19
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Publication No.: US10600890B2Publication Date: 2020-03-24
- Inventor: Yong Li
- Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Applicant Address: CN Shanghai CN Beijing
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN201710355763 20170519
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, a semiconductor fin on the substrate, an isolation region on sidewalls of the semiconductor fin and having an upper surface lower than an upper surface of the semiconductor fin, a gate structure on a portion of the semiconductor fin and on a first portion of the isolation region. The portion of the semiconductor fin covered by the gate structure is referred to as a first region, and a second portion of the isolation region disposed on at least one of two opposite sides of the gate structure is referred to as a second region, which has an upper surface lower than an upper surface of the first region. The semiconductor device also includes a first spacer layer on a sidewall of the gate structure and on a sidewall of a portion of the first region disposed above the second region.
Public/Granted literature
- US20180337264A1 CONTACT TO METAL GATE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-11-22
Information query
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