Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15956611Application Date: 2018-04-18
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Publication No.: US10600904B2Publication Date: 2020-03-24
- Inventor: Hiroyoshi Kudou , Satoru Tokuda , Satoshi Uchiya
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: SGPatents PLLC
- Priority: JP2017-117572 20170615
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L23/482 ; H01L29/423

Abstract:
A semiconductor device according to one embodiment includes: a semiconductor substrate having a first surface and a second surface which is an opposite surface of the first surface; a first wiring and a second wiring disposed on the first surface; a first conductive film electrically connected to the first wiring; and a gate electrode. The semiconductor substrate has a source region, a drain region, a drift region, and a body region. The drift region is disposed so as to surround the body region in a plan view. The first wiring has a first portion disposed so as to extend across a boundary between the drift region and the body region in a plan view, and electrically connected to the drift region. The second wiring is electrically connected to the source region. The first conductive film is insulated from and faces the second wiring.
Public/Granted literature
- US20180366575A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-12-20
Information query
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