Invention Grant
- Patent Title: Semiconductor devices and methods for fabricating the same
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Application No.: US16052768Application Date: 2018-08-02
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Publication No.: US10600909B2Publication Date: 2020-03-24
- Inventor: Ankit Kumar , Chia-Hao Lee
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/08 ; H01L29/66 ; H01L21/02 ; H01L21/265 ; H01L21/266 ; H01L29/06

Abstract:
A semiconductor device includes an epitaxial layer disposed over a semiconductor substrate, a drift region disposed in the epitaxial layer and adjacent to an upper surface of the epitaxial layer, a gate structure disposed over the epitaxial layer, a source region disposed in the epitaxial layer outside the drift region, and a drain region disposed in the drift region. The epitaxial layer and the drift region have a first conductivity type. The semiconductor device also includes a plurality of doped region pairs disposed in the drift region and arranged in a direction from the drain region toward the source region. Each of the plurality of doped region pairs includes a first doped region having a second conductivity type opposite to the first conductivity type, and a second doped region disposed over the first doped region. The second doped region has the first conductivity type.
Public/Granted literature
- US20200044081A1 SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2020-02-06
Information query
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