Invention Grant
- Patent Title: Method for producing hermetic package
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Application No.: US15552535Application Date: 2016-02-25
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Publication No.: US10600954B2Publication Date: 2020-03-24
- Inventor: Toru Shiragami
- Applicant: Nippon Electric Glass Co., Ltd.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-036344 20150226
- International Application: PCT/JP2016/055675 WO 20160225
- International Announcement: WO2016/136899 WO 20160901
- Main IPC: H01L41/23
- IPC: H01L41/23 ; H01L23/10 ; H01L23/02 ; H01L23/08 ; B32B18/00 ; H01L41/053 ; H03H3/02 ; C04B37/04

Abstract:
A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.
Public/Granted literature
- US20180033951A1 METHOD FOR PRODUCING HERMETIC PACKAGE Public/Granted day:2018-02-01
Information query
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