- Patent Title: Semiconductor storage device and method of manufacturing the same
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Application No.: US16126349Application Date: 2018-09-10
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Publication No.: US10600955B2Publication Date: 2020-03-24
- Inventor: Yasuyuki Sonoda
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2018-043150 20180309
- Main IPC: H01L43/00
- IPC: H01L43/00 ; H01L43/02 ; H01L43/12 ; H01L27/22

Abstract:
According to an embodiment, a semiconductor storage device includes a substrate. A stack is provided above the substrate, and includes a resistance change element and a metal layer provided above the resistance change element. A first insulating layer is provided on a side surface of the stack. A second insulating layer is provided on the first insulating layer. And an electrode is provided on the metal layer and on the first insulating layer so as to extend along a stacking direction in the second insulating layer. A lower surface of the electrode as viewed in the direction has a diameter greater than a diameter of an upper surface of the stack as viewed in the direction. A lowermost portion of the electrode is at a same level as an uppermost portion of the metal layer as viewed in the direction.
Public/Granted literature
- US20190280187A1 SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-09-12
Information query
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