Invention Grant
- Patent Title: Non-reciprocal circuit element, manufacturing method therefor, and communication device
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Application No.: US15557521Application Date: 2016-03-17
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Publication No.: US10601097B2Publication Date: 2020-03-24
- Inventor: Tadayuki Ogasawara
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-061847 20150325; JP2015-178410 20150910
- International Application: PCT/JP2016/001545 WO 20160317
- International Announcement: WO2016/152112 WO 20160929
- Main IPC: H01P1/387
- IPC: H01P1/387 ; H01P1/38 ; H01P11/00 ; H04B1/40

Abstract:
The present invention addresses the problem of suppressing variation in the distance between a ferrimagnetic body and the side part of a conductive body cover, thereby suppressing variation in the reflection characteristic and isolation. Therefore, the present invention provides a non-reciprocal circuit element equipped with: a conductive cover provided on a substrate and covering a ferrimagnetic body provided on the substrate; the ferrimagnetic body, on at least the portion of which opposing the side part of the conductive body cover is formed a dielectric body that contacts or substantially contacts the side part of the conductive body cover; and a conductive body part provided on the substrate. Furthermore, the non-reciprocal circuit element is equipped with multiple connecting parts electrically connecting the conductive body part and each of multiple signal transmission wires on the substrate.
Public/Granted literature
- US20180145389A1 NON-RECIPROCAL CIRCUIT ELEMENT, MANUFACTURING METHOD THEREFOR, AND COMMUNICATION DEVICE Public/Granted day:2018-05-24
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