• Patent Title: Non-reciprocal circuit element, manufacturing method therefor, and communication device
  • Application No.: US15557521
    Application Date: 2016-03-17
  • Publication No.: US10601097B2
    Publication Date: 2020-03-24
  • Inventor: Tadayuki Ogasawara
  • Applicant: NEC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: NEC CORPORATION
  • Current Assignee: NEC CORPORATION
  • Current Assignee Address: JP Tokyo
  • Priority: JP2015-061847 20150325; JP2015-178410 20150910
  • International Application: PCT/JP2016/001545 WO 20160317
  • International Announcement: WO2016/152112 WO 20160929
  • Main IPC: H01P1/387
  • IPC: H01P1/387 H01P1/38 H01P11/00 H04B1/40
Non-reciprocal circuit element, manufacturing method therefor, and communication device
Abstract:
The present invention addresses the problem of suppressing variation in the distance between a ferrimagnetic body and the side part of a conductive body cover, thereby suppressing variation in the reflection characteristic and isolation. Therefore, the present invention provides a non-reciprocal circuit element equipped with: a conductive cover provided on a substrate and covering a ferrimagnetic body provided on the substrate; the ferrimagnetic body, on at least the portion of which opposing the side part of the conductive body cover is formed a dielectric body that contacts or substantially contacts the side part of the conductive body cover; and a conductive body part provided on the substrate. Furthermore, the non-reciprocal circuit element is equipped with multiple connecting parts electrically connecting the conductive body part and each of multiple signal transmission wires on the substrate.
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