Invention Grant
- Patent Title: Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding object
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Application No.: US16344198Application Date: 2017-10-12
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Publication No.: US10601147B2Publication Date: 2020-03-24
- Inventor: Tatsuo Tamagawa , Masamichi Yamagiwa , Takuya Suzuki , Daichi Miura
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2016-212975 20161031
- International Application: PCT/JP2017/036920 WO 20171012
- International Announcement: WO2018/079273 WO 20180503
- Main IPC: H01R4/02
- IPC: H01R4/02 ; B23K20/10 ; H01R43/02 ; B23K101/36 ; H01R4/18

Abstract:
The present invention enables a core wire that contains a plurality of strands and a bonding object to be bonded more reliably using an ultrasonic bonding device that cantilever supports a pressing portion that performs ultrasonic bonding. A bonding object (for example, a terminal) is supported as on a stage, a core wire is overlaid on the bonding object, and the core wire and the bonding object are ultrasonically bonded in a state where the core wire is pressed toward the bonding object, using a pressing portion that is supported in cantilever fashion. During ultrasonic bonding, a pressing surface of the pressing portion is inclined in a pressing direction progressively toward a side where the pressing portion is cantilever supported, and also a bonding surface of the bonding object is inclined in the pressing direction progressively toward the side where the pressing portion is cantilever supported.
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