Invention Grant
- Patent Title: Window assembly with casing for solder joint
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Application No.: US14912256Application Date: 2014-08-15
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Publication No.: US10601149B2Publication Date: 2020-03-24
- Inventor: Daniel D. Bennett , William C. Schuch
- Applicant: AGC Automotive Americas R&D, Inc. , AGC Flat Glass North America, Inc.
- Applicant Address: US MI Ypsilanti
- Assignee: AGC Automotive Americas R&D, Inc.
- Current Assignee: AGC Automotive Americas R&D, Inc.
- Current Assignee Address: US MI Ypsilanti
- Agency: Howard & Howard Attorneys PLLC
- International Application: PCT/US2014/051216 WO 20140815
- International Announcement: WO2015/023921 WO 20150219
- Main IPC: H01R4/28
- IPC: H01R4/28 ; H05K3/40 ; H05K1/02 ; H05B3/86 ; B23K1/00 ; B23K1/19 ; H01R4/02 ; H01R13/24 ; H05B3/84 ; H05K1/03 ; H05K3/34 ; H05B1/02

Abstract:
A window assembly (10) includes a transparent pane (18), an electrical conductor (20) contacting the transparent pane (18), an electrical connection element (22) for energizing the electrical conductor (20), an electrically conductive solder joint (28) disposed between the electrical connection element (22) and the electrical conductor (20) for providing an electrical connection between the electrical connection element (22) and the electrical conductor (20), an encapsulation (26) over the electrical connection element (22) and the electrical conductor (20), and a casing (30) disposed between the encapsulation (26) and the electrical conductor (20) to prevent contact between the encapsulation (26) and the solder joint (28).
Public/Granted literature
- US20160204522A1 Window Assembly With Casing For Solder Joint Public/Granted day:2016-07-14
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