- Patent Title: Method of manufacturing wire with terminal and crimping terminal
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Application No.: US15782639Application Date: 2017-10-12
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Publication No.: US10601207B2Publication Date: 2020-03-24
- Inventor: Masayoshi Takayanagi , Naoki Ito , Keiichiroh Kurashige , Koichi Ikebe
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2016-201870 20161013
- Main IPC: H02G1/14
- IPC: H02G1/14 ; H01R4/18 ; H01R43/048 ; H01R43/052

Abstract:
A method of manufacturing a wire with a terminal includes a crimping process of crimping a crimping terminal on a wire by a terminal crimping apparatus that includes a first mold including a supporting surface supporting the crimping terminal, and a second mold disposed to face the supporting surface and including a recessed wall surface. The recessed wall surface includes a first wall surface and a second wall surface, and a third wall surface curved toward an opposite side of the supporting surface. The first wall surface and the second wall surface include inclined portions and parallel portions. The inclined portions are inclined with respect to the stroke direction so that an interval in the width direction becomes narrower toward the third wall surface. The parallel portions are parallel to the stroke direction. In the crimping process, the side wall surfaces of the first mold face the inclined portions in a state in which the first mold and the second mold come closest to each other in the stroke direction.
Public/Granted literature
- US20180109088A1 METHOD OF MANUFACTURING WIRE WITH TERMINAL AND CRIMPING TERMINAL Public/Granted day:2018-04-19
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