Invention Grant
- Patent Title: Electromagnetic-coupling-module-attached article
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Application No.: US16179014Application Date: 2018-11-02
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Publication No.: US10601254B2Publication Date: 2020-03-24
- Inventor: Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-122487 20060426; JP2006-182686 20060630; JP2006-347460 20061225
- Main IPC: H02J50/12
- IPC: H02J50/12 ; G06K19/077

Abstract:
An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
Public/Granted literature
- US20190074725A1 ELECTROMAGNETIC-COUPLING-MODULE-ATTACHED ARTICLE Public/Granted day:2019-03-07
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