Invention Grant
- Patent Title: Elastic wave device
-
Application No.: US15586315Application Date: 2017-05-04
-
Publication No.: US10601389B2Publication Date: 2020-03-24
- Inventor: Daisuke Sekiya , Taku Kikuchi , Hiroshi Tanaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-245794 20141204
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H3/10 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; H03H9/10 ; H03H9/145 ; H03H9/64 ; H01L23/367 ; H01L41/297 ; H01L41/337 ; H01L41/338 ; H01L41/053

Abstract:
An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.
Public/Granted literature
- US20170237406A1 METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE AND ELASTIC WAVE DEVICE Public/Granted day:2017-08-17
Information query