Invention Grant
- Patent Title: Elastic wave device and manufacturing method thereof
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Application No.: US15430887Application Date: 2017-02-13
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Publication No.: US10601394B2Publication Date: 2020-03-24
- Inventor: Taku Kikuchi , Akira Michigami , Daisuke Sekiya , Masashi Tsubokawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-213806 20141020
- Main IPC: H03H9/145
- IPC: H03H9/145 ; H03H3/08 ; H03H9/02 ; H03H9/64 ; H03H9/10 ; H03H9/25 ; H03H9/54

Abstract:
An elastic wave device includes interdigital transducer electrodes on a piezoelectric substrate and wires electrically connected to the interdigital transducer electrodes. The wires include a first wire and a second wire. The device further includes an interlayer insulating film made from an inorganic dielectric material and covering a portion of the first wire. A portion of the second wire bridges a portion of the first wire with the interlayer insulating film provided therebetween. In a region, in a bridged area, where the second wire extends from a region on an outer side portion of the interlayer insulating film to above the interlayer insulating film, first auxiliary wire electrodes are provided on the piezoelectric substrate, such that when viewed in plan view, the first auxiliary wire electrodes at least partially overlap with the second wire and extend to within the interlayer insulating film.
Public/Granted literature
- US20170155372A1 ELASTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-01
Information query
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